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Standard Products
UT63M147 MIL-STD-1553A/B Bus Transceiver
Data Sheet May 2006
FEATURES 5-volt only operation (+10%) Fit and functionally compatible to industry standard transceiver Idle low transmitter inputs and receiver outputs Dual-channel 50-mil center 24-lead Flatpack Dual-channel 100-mil center 36-pin DIP Full military operating temperature range, -55C to +125C, screened to QML Q or QML V requirements Radiation hardened to 1.0E6 rads(Si) Supports MIL-STD-1553 (UT63M147) Standard Microcircuit Drawing (SMD) 5962-93226 available
INTRODUCTION The monolithic UT63M147 Transceivers are complete transmitter and receiver pairs for MIL-STD-1553A and 1553B applications. Encoder and decoder interfaces are idle low. The receiver section of the UT63M147 series accepts biphasemodulated Manchester II bipolar data from a MIL-STD-1553 data bus and produces TTL-level signal data at its RXOUT and RXOUT outputs. An external RXEN input enables or disables the receiver outputs.
RXEN
RXOUT RXIN RXIN F ILTER and LIMITER THRESHOLD REFERENCE DRIVERS TXOUT COMPARE TXOUT TXIN F ILTER TO DECODER RXOUT
TXIN
TXIHB
Figure 1. Functional Block Diagram
1
The transmitter section accepts biphase TTL-level signal data at its TXIN and TXIN and produces MIL-STD-1553 data signals. The transmitter's output voltage is typically 12 VPP, L-L. Activating the TXIHB input or setting both data inputs to the same logic level disables the transmitter outputs. Legend for TYPE field: TI TO DO DI DIO () [] = = = = = = = TTL input TTL output Differential output Differential input Differential input/output Channel designator 24-lead flatpack
The UT63M14x series offers complete transmitter and receiver pairs packaged in a dual-channel 36-pin DIP or 24-lead flatpack configurations designed for use in any MIL-STD-1553 application.
TRANSMITTER NAME TXOUT 1 (A) TXOUT (B) TXOUT 1 (A) TXOUT (B) TXIHB (A) TXIHB (B) TXIN (A) TXIN (B) TXIN (A) TXIN (B) PIN NUMBER 1 [1] 10 [7] 2 [2] 11 [8] 34 [22] 25 [16] 35 [23] 26 [17] 36 [24] 27 [18] TYPE DO [DIO] DO [DIO] DO [DIO] DO [DIO] TI TI TI TI TI TI TXIN is the complement of TXIN input. Transmitter input: TXIN and TXIN are complementary TTLlevel Manchester II encoder inputs. Transmitter inhibit: This is an active high input signal. TXOUT is the half-cycle complement of TXOUT. DESCRIPTION Transmitter outputs: TXOUT and TXOUT are differential data signals.
Note: 1. The 24-lead flatpack internally connects TXOUT to RXIN (CHA, CHB) and TXOUT to RXIN (CHA, CHB) for each channel.
Appendix 2 - 2
RECEIVER NAME RXOUT (A) RXOUT (B) RXOUT (A) RXOUT (B) RXEN (A) RXEN (B) RXIN 1 (A) RXIN (B) RXIN 1 (A) RXIN (B) PIN NUMBER 5 [4] 14 [10] 8 [6] 17 [12] 6 [5] 15 [11] 29 [1] 20 [7] 30 [2] 21 [8] TYPE TO TO TO TO TI TI DI [DIO] DI [DIO] DI [DIO] DI [DIO] RXIN is the half-cycle complement of RXIN input. Receiver input: RXIN and RXIN are biphase-modulated Manchester II bipolar inputs from MIL-STD-1553 data bus. Receiver enable/disable: This is an active high input signal. RXOUT is the complement of RXOUT output. DESCRIPTION Receiver outputs: RXOUT and RXOUT are complementary Manchester II decoder outputs.
Note: 1. The 24-lead flatpack internally connects TXOUT to RXIN (CHA, CHB) and TXOUT to RXIN (CHA, CHB) for each channel.
POWER AND GROUND NAME VCC (A) VCC (B) GND (A) GND (B) PIN NUMBER 33 [20] 24 [14] 3, 7, 31 [3,19,21] 12, 16, 22 [9,13,15] TYPE PWR PWR GND GND DESCRIPTION +5 VDC power (10%) Recommended decoupling capacitors: 47F (tantalum), 0.1F (ceramic) and 0.01F (ceramic)
Ground reference
Appendix 2 - 3
TXOUT TXOUT GND NC RXOUT RXEN GND RXOUT NC TXOUT TXOUT GND NC RXOUT RXEN GND RXOUT NC
1 2 3 4 5 6 7 8 9 10 11 12 CHANNEL A
36 35 34 33 32 31 30 29 28 27 26 25
TXIN TXIN TXIHB VCC NC GND RXIN RXIN NC
TXIN TXIN TXIHB VCC NC GND RXIN RXIN NC
13 CHANNEL B 24 23 14 15 16 17 18 22 21 20 19
Figure 2a. Functional Pin Diagram -- Dual Channel (36)
CHA CHA GND RXOUT RXEN RXOUT
1 2 3 4 5 6 7 8 9 10 11 12 CHANNEL B CHANNEL A
24 23 22 21 20 19 18 17 16 15 14 13
TXIN TXIN TXIHB GND VCC GND
CHB CHB GND RXOUT RXEN RXOUT
TXIN TXIN TXIHB GND VCC GND
Figure 2b. Functional Pin Diagram -- Dual Channel (24) 1
Note: 1. The 24-lead flatpack internally connects TXOUT to RXIN (CHA, CHB) and TXOUT to RXIN (CHA, CHB) for each channel.
Appendix 2 - 4
TRANSMITTER The transmitter section accepts Manchester II biphase TTL data and converts this data into differential phase-modulated current drive. Transmitter current drivers are coupled to a MIL-STD1553 data bus via a transformer driven from the TXOUT and TXOUT terminals. Transmitter output terminals' nontransmitting state is enabled by asserting TXIHB (logic "1"), or by placing both TXIN and TXIN at the same logic level. Table 1, Transmit Operating Mode, lists the functions for the output data in reference to the state of TXIHB. Figure 3 shows typical transmitter waveforms. RECEIVER The receiver section accepts biphase differential data from a MIL-STD-1553 data bus at its RXIN and RXIN inputs. The receiver converts input data to biphase Manchester II TTL format and is available for decoding at the RXOUT and RXOUT terminals. The outputs RXOUT and RXOUT represent positive and negative excursions (respectively) of the inputs RXIN and RXIN. Figure 4 shows typical receiver output waveforms. Table 1. Transmit Operating Mode TXIN x1 0 0 1 1 TXIN x 0 1 0 1 TXIHB 1 x 0 0 x TXOUT Off2 Off3 On On Off3
TXIN
TXIN
BOTH HIGH OR BOTH LOW
TXIHB LINE-TO-LINE DIFFERENTIAL OUTPUT TXOUT, TXOUT 90%
10%
TXIN
TXIN tTXDD
Figure 3. Typical Transmitter Wave
LINE-TO-LINE DIFFERENTIAL INPUT
Notes: 1. x = Don't care. 2. Transmitter output terminals are in the non-transmitting mode during Off-time. 3. Transmitter output terminals are in the non-transmitting mode during Off-time, independent of TXIHB status.
RXOUT RXOUT
RXOUT RXOUT
tRXDD
Figure 4. Typical Receiver Waveforms Appendix 2 - 5
DATA BUS INTERFACE 1 The designer can connect the UT63M14x to the data bus via a short-stub (direct-coupling) connection or a long-stub (transformer-coupling) connection. Use a short-stub connection when the distance from the isolation transformer to the data bus does not exceed a one-foot maximum. Use a long-stub connection when the distance from the isolation transformer exceeds the one-foot maximum and is less than twenty feet. Figure 5 shows various examples of bus coupling configurations. The UT63M14x series transceivers are designed to function with MIL-STD-1553A and 1553B compatible transformers.
Note: 1. The 24-lead flatpack internally connects TXOUT to RXIN and TXOUT to RXIN for each channel.
RECOMMENDED THERMAL PROTECTION All packages should mount to or contact a heat removal rail located in the printed circuit board. To insure proper heat transfer between the package and the heat removal rail, use a thermally-conductive material between the package and the heat removal rail. Use a material such as Mereco XLN-589 or equivalent to insure heat transfer between the package and heat removal rail.
1:2.5
SHORT-STUB DIRECT COUPLING 1 FT. MAX.
55 OHMS
ZO
+5V DC OPERATION
55 OHMS
1:1.79 TXOUT RXIN
20 FT MAX
1:1.4
.75 ZO
.75 ZO TXOUT RXIN LONG-STUB TRANSFORMER COUPLING
Note: Figure 8. ZO defined per MIL-STD-1553B, Section 4.5.1.5.2.1.
Transceiver Test Circuit MIL-STD-1553B
ZO
Figure 5. Bus Coupling Configuration
Appendix 2 - 6
VCC
RECEIVER 55 OHMS 35 OHMS RXIN Vin 55 OHMS RXEN TRANSMITTER TXIN TXOUT 1:2.5 RXOUT 15 pF 2.5:1 RXOUT RXIN 15 pF
2KOHMS
2KOHMS
* TP
TP
55 OHMS
RL =
35 OHMS
A
TXIN
TXOUT
55 OHMS
TXIHB Notes: 1. TP = Test point. 2. RL removed for terminal input impedance test. 3. TXOUT and RXIN tied together. TXOUT and RXIN tied together.
Figure 6. Direct Coupled Transceiver with Load
VCC
RECEIVER 1.4:1 Vin RXIN 15 pF 1.79:1 RXIN 15 pF
2KOHMS RXOUT * TP RXOUT TP
2KOHMS
RXEN TRANSMITTER TXIN TXOUT 1:1.79 A TXIN TXIHB
Notes: 1. TP = Test point. 2. RL removed for terminal impedance test. 3. TXOUT and RXIN tied together. TXOUT and RXIN tied together.
1:1.4
.75 ZO 35 OHMS .75 ZO B
TXOUT
Figure 7. Transformer Coupled Transceiver with Load
Appendix 2 - 7
TXOUT TERMINAL RL A TXOUT
Notes: 1. Transformer Coupled Stub: Terminal is defined as transceiver plus isolation transformer. Point A is defined in figure 7. 2. Direct Coupled Stub: Terminal is defined as transceiver plus isolation transformer and fault resistors. Point A is defined in figure 6.
Figure 8. Transceiver Test Circuit MIL-STD-1553 ABSOLUTE MAXIMUM RATINGS 1 PARAMETER VCC Input voltage range (receiver) Logic input voltage range Power dissipation 100% duty cycle (per channel) Thermal impedance junction to case2 Maximum junction temperature Storage temperature Receiver common mode input voltage range LIMITS -0.3 to +7.0 10 -0.3 to +5.5 3.6 6.0 +175 -65 to +150 -5.0 to +5.0 UNIT V VPP, L-L V W C/W C C V
Notes: 1. Stress outside the listed absolute maximum rating may cause permanent damage to the devices. This is a stress rating only, and functional operation of the device at these or any other conditions beyond limits indicated in the operational sections of this specification is not recommended. Exposure to absolute maximum rating conditions for extended periods may affect device reliability. 2. Mounting per MIL-STD-883, Method 1012.
RECOMMENDED OPERATING CONDITIONS PARAMETER Supply voltage range Logic input voltage range Receiver differential voltage Receiver common mode voltage range Driver peak output current Serial data rate Case operating temperature range (TC) LIMITS +4.50 to +5.50 0 to +5.0 8.0 +4.0 600 0.3 to 1 -55 to +125 UNIT V V VP-P V mA MHz C
Appendix 2 - 8
DC ELECTRICAL CHARACTERISTICS 1 VCC = 5.0V 10% -55C < TC < +125C SYMBOL VIL VIH IIL IIH VOL VOH ICC PARAMETER Input low voltage Input high voltage Input low current Input high current Output low voltage Output high voltage VCC supply current 2.4 22 200 380 650 740 2.0 -0.1 -40 40 .55 MINIMUM MAXIMUM 0.8 UNIT V V mA A V V mA mA mA mA mA CONDITION RXEN, TXIHB, TXIN, TXIN RXEN, TXIHB, TXIN, TXIN VIL = 0.4V; RXEN, TXIHB, TXIN, TXIN VIH = 2.7V; RXEN, TXIHB, TXIN, TXIN IOL = 4mA; RXOUT, RXOUT IOH = 0.4mA; RXOUT, RXOUT 0% duty cycle (non-transmitting) 25% duty cycle ( = 1MHz) 50% duty cycle ( = 1MHz) 87.5% duty cycle ( = 1MHz) 100% duty cycle ( = 1MHz)2
Note: 1. All tests guaranteed per test figure 6. 2. Guaranteed but not tested.
Appendix 2 - 9
RECEIVER ELECTRICAL CHARACTERISTICS 1 VCC = 5.0V 10% -55C < TC < +125C SYMBOL CIN 2 COUT2 VIC 5 PARAMETER Input capacitance Output capacitance Common mode input voltage Input threshold voltage4 (no response) -5 MINIMUM MAXIMUM 15 20 5 UNIT pF pF V CONDITION RXEN; input = 1MHz @ 0V RXOUT, RXOUT; = 1MHz @ 0V Direct-coupled stub; input 1.2 VPP, 200ns rise/fall time 25ns, = 1MHz Transformer-coupled stub; input at = 1MHz, rise/fall time 200ns at (Receiver output 0 1 transition) Direct-coupled stub; input at = 1MHz, rise/fall time 200ns at (Receiver output 0 1 transition) Transformer-coupled stub; input at = 1MHz, rise/fall time 200ns at (Receiver output 0 1 transition) Direct-coupled stub; input at = 1MHz, rise/fall time 200ns at (Receiver output 0 1 transition)
VTH
0.20
VPP,L-L
Input threshold voltage (no response) Input threshold voltage4 (response) 0.86
0.28
VPP,L-L
14.0
VPP,L-L
VPP,L-L Input threshold voltage (response) CMRR5 Common mode rejection ratio 1.20 20.02 N/A
Pass/Fail 3
Notes: 1. All tests guaranteed per test figure 6. 2. Capacitance is measured only for initial qualification and after any process or design changes which may affect input or output capacitance. 3. Pass/fail criteria per the test method described in MIL-HDBK-1553 Appendix A, RT Validation Test Plan, Section 5.1.2.2, Common Mode Rejection. 4. Guaranteed by design. 5. Guaranteed to the limits specified if not tested.
Appendix 2 - 10
TRANSMITTER ELECTRICAL CHARACTERISTICS 1 VCC = 5.0V 10% -55C < TC < +125C SYMBOL VO PARAMETER Output voltage swing per MIL-STD-1553B 3, 5 (see figure 9) per MIL-STD-1553B (see figure 9) per MIL-STD-1553A 5 (see figure 9) VNS2 Output noise voltage differential (see figure 9) MINIMUM 18 MAXIMUM 27 UNIT VPP,L-L CONDITION Transformer-coupled stub, Figure 8, Point A; input = 1MHz, RL = 70 ohms Direct-coupled stub, Figure 8, Point A; input = 1MHz, RL = 35 ohms Figure 7, Point A; input = 1MHz, RL = 35 ohms Transformer-coupled stub, Figure 8, Point A; input = DC to 10MHz, RL = 70 ohms Direct-coupled stub, Figure 8, Point A; input = DC to 10MHz, RL = 35 ohms VOS4 Output symmetry -250 +250 mVPP,L-L Transformer-coupled stub, Figure 8, Point A; RL = 140 ohms, measurement taken 2.5s after end of transmission Direct-coupled stub, Figure 8, Point A; RL = 35 ohms, measurement taken 2.5s after end of transmission Transformer-coupled stub, Figure 8, Point A; RL = 70 ohms Direct-coupled stub, Figure 8, Point A; RL = 35 ohms RXEN, TXIHB, TXIN, TXIN; input = 1MHz @ 0V Transformer-coupled stub, Figure 7, Point A; input = 75KHz to 1MHZ (power on or power off; nontransmitting, RL removed from circuit). Direct-coupled stub, Figure 6, Point A; input = 75KHz to 1MHZ (power on or power off; non-transmitting, RL removed from circuit).
6.0
9.0
VPP,L-L
6.0
20
VPP,L-L
14 5
mV-RMS L-L mV-RMS L-L
-90
+90
mVPP,L-L
VDIS
Output voltage distortion (overshoot or ring) (see figure 9)
-900 -300
+900 +300 15
mVpeak,L-L mVpeak,L-L pF Kohm
CIN 2 TIZ 5
Input capacitance Terminal input impedance 1
2
Kohm
Notes: 1. All tests guaranteed per test figure 6. 2. Guaranteed by device characterization. Capacitance is measured only for initial qualification and after any process or design changes which may affect input or output capacitance. 3. For MIL-STD-1760, 22 Vp-p, L-L min. 4. Test in accordance with the method described in MIL-STD-1553B output symmetry, section 4.5.2.1.1.4. 5. Guaranteed to the limits specified if not tested.
Appendix 2 - 11
AC ELECTRICAL CHARACTERISTICS 1 VCC = 5.0V 10% -55C < TC < +125C SYMBOL tR, tF PARAMETER Transmitter output rise/ fall time (see figure 10) MINIMUM 100 MAXIMUM 300 UNIT ns CONDITION Input = 1MHz 50% duty cycle: direct-coupled RL = 35 ohms output at 10% through 90% points TXOUT, TXOUT. Figure 10. RXOUT to RXOUT, Figure 4. TXIN to TXIN, Figure 3. Direct-coupled stub; input = 1MHz, 3 VPP (skew INPUT 150ns), rise/fall time 200ns. Input TXIN and TXIN should create Transmitter output zero crossings at 500ns, 1000ns, 1500ns, and 2000ns. These zero crossings should not deviate more than 25ns. TXIN and TXIN toggling @ 1MHz; TXIHB transitions from logic zero to one, see figure 12. TXIN and TXIN toggling @ 1MHz; TXIHB transitions from logic one to zero, see figure 13. Receiver turn off time, see figure 13. Receiver turn on time, see figure 13. Receiver propagation delay, see figure 13. Transmitter propagation delay, see figure 12.
tRXDD tTXDD 3 tRZCD
RXOUT delay TXIN skew Zero crossing distortion (see figure 11) Zero crossing stability (see figure 11)
-200 -25 -150
200 25 150
ns ns ns
tTZCS
-25
25
ns
tRDXOFF3,4
Transmitter off; delay from inhibit active Transmitter on; delay from inhibit inactive Receiver off Receiver on Receiver propagation Transmitter propagation
100
ns
tDXON 3,5
150
ns
tRCVOFF 3 tRCVON 3 tRCVPD 3 tXMITPD 3
50 50 450 200
ns ns ns ns
Notes: 1. All tests guaranteed per test figure 6. 2. Guaranteed by device characterization. 3. Supplied as a design limit but not guaranteed or tested. 4. Delay time from transmit inhibit (1.5V) rising to transmit off (280mV). 5. Delay time from not transmit inhibit (1.5V) falling to transmit off (1.2V).
Table 2. Transformer Requirements COUPLING TECHNIQUE DIRECT-COUPLED: Isolation Transformer Ratio TRANSFORMER-COUPLED: Isolation Transformer Ratio Coupling Transformer Ratio 5VDC 2.5:1 1.79:1 1:1.4
Appendix 2 - 12
VDIS (Ring)
VDIS (Overshoot)
0 Volts
VO
0 Volts
VNS
Figure 9. Transmitter Output Characteristics (VDIS, VNS, VO)
tR 90% 90%
VO tTZCS 10% tF 10%
Figure 10. Transmitter Output Zero Crossing Stability, Rise Time, Fall Time (tTZCS, tR, tF)
VIN tRZCD
Figure 11. Receiver Input Zero Crossing Distortion (tRZCD)
Appendix 2 - 13
10%
zero crossing 10%
TX OUTPUT
tDXON tXMITPD 50%
tDXOFF 50% INHIBIT
50%
TX IN and TX IN
Figure 12. Transmitter Timing
zero crossing
RX INPUT
RXEN tRCVPD
50% 50% tRCVON tRCVOFF RX OUT and RX OUT RXEN
50%
50%
50%
Figure 13. Receiving Timing
Appendix 2 - 14
0.001 MIN.
.023 MAX. .014 MIN. LEAD 1 INDICATOR
1.89 MAX.
0.100
0.005 MIN.
.610 MAX. .570 MIN.
0.155 MAX.
0.150 MIN.
.015 MAX. .008 MIN. .620 MAX. .590 MIN. (AT SEATING PLANE)
Notes: 1. Package material: opaque ceramic. 2. All package finishes are per MIL-PRF-38535. 3. It is recommended that package ceramic be mounted on a heat removal rail in the printed circuit board. A thermally conductive material should be used.
Figure 14. 36-Pin Side-Brazed DIP, Dual Cavity
LEAD 1 INDICATOR
0.016 .002
.810 MAX.
.050 .600 MAX. .400 MIN.
0.130 MAX.
.010 + .002 - .001
0.070 0.010 (AT CERAMIC BODY) Notes: 1. Package material: opaque ceramic. 2. All package plating finishes are per MIL-PRF-38535. 3. It is recommended that package ceramic be mounted to a heat removal rail located in the printed circuit board. A thermally conductive material should be used.
Figure 15. 24-Lead Flatpack, Dual Cavity (50-mil lead spacing)
Appendix 2 - 16
LEAD 1 INDICATOR
0.016 .002
.810 MAX.
.050 .600 MAX. .400 MIN.
0.130 MAX.
.010 + .002 - .001
0.070 0.010 (AT CERAMIC BODY) Notes: 1. Package material: opaque ceramic. 2. All package plating finishes are per MIL-PRF-38535. 3. It is recommended that package ceramic be mounted to a heat removal rail located in the printed circuit board. A thermally conductive material should be used.
Figure 15. 24-Lead Flatpack, Dual Cavity (50-mil lead spacing)
16
ORDERING INFORMATION UT63M14x Monolithic Transceiver, 5V Operation: SMD 5962 * 93226 * * * *
Lead Finish: (A) = Solder (C) = Gold (X) = Optional Case Outline: (X) = 36 pin DIP (Z) = 24 pin FP Class Designator: (Q) = Class Q (V) = Class V Device Type (03) = Idle low Drawing Number: 93226 Total Dose: (H) = 1E6 rads(Si) (G) = 5E5 ads(Si) (F) = 3E5 rads(Si) (R) = 1E5rads(Si) (-) = None Federal Stock Class Designator: No options
Notes: 1. Lead finish (A, C, or X) must be specified. 2. If an "X" is specified when ordering, part marking will match the lead finish and will be either "A" (solder) or "C" (gold). 3. Total dose must be specified for all QML Q and QML V devices. 4. Neutron irradiation limits will be added when available.
17
UT63M14x Monolithic Transceiver, 5V Operation
UT63M-
*
*
*
*
Total Dose: () = None Lead Finish: (A) = Solder (C) = Gold (X) = Optional Screening: (C) = Military Temperature (P) = Prototype Package Type: (B) = 36-pin DIP (C) = 24-pin FP Device Type Modifier: 147 = Idle Low Transceiver
Notes: 1. Lead finish (A, C, or X) must be specified. 2. If an "X" is specified when ordering, part marking will match the lead finish and will be either "A" (solder) or "C" (gold). 3. Military Temperature range devices are burned-in and tested at -55C, room temperature, and 125C. Radiation characteristics are neither tested nor guaranteed and may not be specified. 4. Devices have prototype assembly and are tested at 25C only. Radiation characteristics are neither tested nor guaranteed and may not be specified. Lead finish is GOLD only.
18
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